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 DISCRETE SEMICONDUCTORS
DATA SHEET
BLT92/SL UHF power transistor
Product specification May 1989
Philips Semiconductors
Product specification
UHF power transistor
DESCRIPTION NPN silicon planar epitaxial transistor primarily intended for use in handheld radio stations in the 900 MHz communications band. This device has been designed specifically for class-B operation. PIN CONFIGURATION FEATURES * internal input matching capacitor for a high power gain * gold metallization ensures excellent reliability The transistor has a 4-lead studless envelope with a ceramic cap (SOT122D). All leads are isolated from the mounting base. PINNING 1 = collector 2 = emitter 3 = base 4 = emitter Fig.1 Simplified outline, SOT122D.
2
MSB055
BLT92/SL
QUICK REFERENCE DATA RF performance at Tmb = 25 C in a common-emitter class-B circuit MODE OF OPERATION CW (class-B) VCE (V) 7.5 f (MHz) 900 PL (W) 3.0 Gp (dB) > 7.0 C (%) > 50
handbook, halfpage
4
1
3
PRODUCT SAFETY This device incorporates beryllium oxide (BeO), the dust of which is toxic. The device is entirely safe provided that the internal BeO disc is not damaged.
May 1989
2
Philips Semiconductors
Product specification
UHF power transistor
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Collector-base voltage (open emitter) Collector-emitter voltage (open base) Emitter-base voltage (open collector) Collector current DC or average (peak value); f > 800 MHz Total power dissipation at Tamb < 120 C; f > 800 MHz Storage temperature range Operating junction temperature THERMAL RESISTANCE Dissipation = 10 W; Tmb = 25 C From junction to mounting base (f > 800 MHz) Rth j-mb(RF) max. Ptot Tstg Tj max. max. IC; IC(AV) ICM max. max. VCBO VCEO VEBO max. max. max.
BLT92/SL
20 V 10 V 3.0 V 1.2 A 3.6 A 10 W 200 C
-65 to +150 C
6.0 K/W
handbook, halfpage
20
MDA297
Ptot
(W) 16
(1)
12
(2)
8
4
0 0 40 80 120 160 200 Tmb (C)
(1) Short-time RF operation during mismatch (f > 800 MHz). (2) Continuous RF operation (f > 800 MHz).
Fig.2 Total power dissipation as a function of temperature.
May 1989
3
Philips Semiconductors
Product specification
UHF power transistor
CHARACTERISTICS Tj = 25 C unless otherwise specified Collector-base breakdown voltage open emitter; IC = 10 mA Collector-emitter breakdown voltage open base; IC = 20 mA Emitter-base breakdown voltage open collector; IE = 2 mA Collector cut-off current VBE = 0; VCE = 10 V Second breakdown energy L = 25 mH; f = 50 Hz; RBE = 10 DC current gain IC = 600 mA; VCE = 5 V Collector capacitance at f = 1 MHz IE = ie = 0; VCB = 7.5 V Feedback capacitance at f = 1 MHz IC = 0; VCE = 7.5 V Collector-mounting base capacitance Cre Cc-mb typ. typ. Cc typ. hFE > ESBR > ICES < V(BR)EBO > V(BR)CEO > V(BR)CBO >
BLT92/SL
20 V 10 V 3.0 V 5.0 mA 1.0 mJ 25 11 pF 6.0 pF 1.2 pF
handbook, halfpage
24
MDA298
Cc (pF) 16
8
0 0 2 4 6 8 10 VCB (V)
Fig.3 Collector capacitance as a function of collector-base voltage; f = 1 MHz; IE = ie = 0; typical values.
May 1989
4
Philips Semiconductors
Product specification
UHF power transistor
APPLICATION INFORMATION RF performance in CW operation (common-emitter circuit; class-B); f = 900 MHz; Tmb = 25 C MODE OF OPERATION VCE (V) 7.5 PL (W) 3.0 > typ. Gp (dB) 7.0 8.5
BLT92/SL
C (%) > typ. 50 57
Class-B; CW
handbook, full pagewidth
50
,,,,,,,, ,,,,,,, ,,,,,,,, ,,,,,,,
L1 C4 L2 L3 D.U.T. L4 C5 L5 C6 C9 L6 C1 C2 C3 C7 C8 C10 L7 L8 L10 R1 L9 C12 R2 C13 C14
C11
50
+VCC
MDA299
Fig.4 Class-B test circuit at f = 900 MHz.
List of components: C1 C3 C4 C11 L1 L2 L3 L5 L6 L7 L8 L9 R1 = C2 = C8 = C10 = 1.4 to 5.5 pF film dielectric trimmer (cat. no. 2222 809 09001) = C6 = C7 = 3.3 pF multilayer ceramic chip capacitor(1) = C5 = C9 = 5.6 pF multilayer ceramic chip capacitor(1) = C12 = C13 = 180 pF multilayer ceramic chip capacitor = 50 stripline (25 mm x 2.4 mm) = 50 stripline (11 mm x 2.4 mm) = L4 = 25 stripline (11.5 mm x 6.0 mm) = 50 stripline (7.0 mm x 2.4 mm) = 50 stripline (27.0 mm x 2.4 mm) = 4 turns closely wound enamelled Cu wire (0.4 mm), int. dia;. 3 mm, with ferrite beat (cat. no. 4330 830 32221) over the coldside lead = 1 turn Cu wire (1.0 mm); int. dia. 5.5 mm; length 2 mm; leads 2 x 5 mm = L10 = Ferroxcube wideband HF choke, grade 3B (cat. no. 4312 020 36642) = R2 = 10 5%; 0.25 W metal film resistor
C14 = 1 F (35 V) tantalum capacitor
The striplines on a double Cu-clad printed circuit board with PTFE fibreglass dielectric (r = 2.2); thickness 1/32 inch; thickness of copper-sheet 2 x 35 m. Note 1. American Technical Ceramics capacitor type 100 A or capacitor of same quality.
May 1989
5
Philips Semiconductors
Product specification
UHF power transistor
BLT92/SL
handbook, full pagewidth
135 mm
70 mm
+VCC L8 L5 C8 R2 R1 L4 L3 C7 C6 L7 L6 C5 L9 C9
C10 C11
C1 L1
C2
C4 L2 C3
C13 C14 L10 C12
MDA300
Fig.5 Printed circuit board and component layout for 900 MHz class-B test circuit.
Note: The circuit and the components are on one side of the PTFE fibreglass board; the other side is un-etched copper serving as groundplane. Earth connections are made by hollow rivets and also by fixing-screws and copper straps around the board and under the emitters to provide a direct contact between the copper on the component side and the groundplane.
May 1989
6
Philips Semiconductors
Product specification
UHF power transistor
BLT92/SL
handbook, halfpage
5
MDA301
PL (W) 4
handbook, halfpage
10 Gp
MDA302
Gp
100 C (%) 80
(dB) 8 Gp C 6 C
3
60
2
4
40
1
2
20
0 0 0.4 0.8 PS (W) 1.2
0 0 1 2 3 4 PL (W) f = 900 MHz; Tmb = 25 C; class-B operation; typical values. VCE = 7.5 V - - - VCE = 5.0 V 5
0
f = 900 MHz; Tmb = 25 C; class-B operation; typical values. VCE = 7.5 V - - - VCE = 5.0 V
Fig.6
Load power as a function of source power.
Fig.7
Power gain and efficiency as a function of load power.
RUGGEDNESS The device is capable of withstanding a full load mismatch (VSWR = 50; all phases) at rated load power up to a supply voltage of 9.0 V at Tmb = 25 C.
May 1989
7
Philips Semiconductors
Product specification
UHF power transistor
BLT92/SL
handbook, halfpage
10
MDA303
handbook, halfpage
5
MDA304
Zi () 8
xi
ZL () 4 RL
6
ri
3
4
2 XL
2
1
0 750
800
850
900
950 1000 f (MHz)
0 750
800
850
900
950 1000 f (MHz)
VCE = 7,5 V; PL = 3 W; f = 800 - 960 MHz; Tmb = 25 C; class-B operation; typical values.
VCE = 7,5 V; PL = 3 W; f = 800 - 960 MHz; Tmb = 25 C; class-B operation; typical values.
Fig.8
Input impedance as a function of frequency (series components).
Fig.9
Load impedance as a function of frequency (series components).
handbook, halfpage
10
MDA305
Gp (dB) 8
6
4
2
0 750
800
850
900
950 1000 f (MHz)
VCE = 7,5 V; PL = 3 W; f = 800 - 960 MHz; Tmb = 25 C; class-B operation; typical values.
Fig.10 Power gain as a function of frequency.
May 1989
8
Philips Semiconductors
Product specification
UHF power transistor
PACKAGE OUTLINE Studless ceramic package; 4 leads
BLT92/SL
SOT122D
D
A
Q c D2
H b
4 L
3 H 1
2
0
5 scale
10 mm
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT mm A 4.17 3.27 b 5.85 5.58 c 0.18 0.14 D 7.50 7.23 D2 7.24 6.98 H 27.56 25.78 L 9.91 9.14 Q 1.58 1.27
90
OUTLINE VERSION SOT122D
REFERENCES IEC JEDEC EIAJ
EUROPEAN PROJECTION
ISSUE DATE 97-04-18
May 1989
9
Philips Semiconductors
Product specification
UHF power transistor
DEFINITIONS Data Sheet Status Objective specification Preliminary specification Product specification Limiting values
BLT92/SL
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
May 1989
10


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